Sigbeat AI Modules are advanced Android AI computing and modem modules that combine intelligent processing with seamless connectivity. Designed to power smart devices and applications, these modules offer robust AI capabilities and reliable network integration, making them ideal for complex data-driven tasks, edge computing, and IoT deployments.
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Specification
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AC312
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AL348
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AL380
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|---|---|---|---|
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AI Performance
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12 TOPS
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48 TOPS
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|
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Processor Platform
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Qualcomm QCS6490
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Qualcomm QCS6490
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Wi-Fi / BT
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Wi-Fi 6E / BT 5.2
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Wi-Fi 7 / BT 5.3
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Wi-Fi 7 / BT 6.0
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Operating System
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Android 14 / Ubuntu 20.04
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Android 13
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Android 15
|
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Memory
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4GB LPDDR4x + 64GB UFS
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16GB LPDDR5x + 256GB UFS
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16GB LPDDR5x + 256GB UFS
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Package
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LCC + LGA
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LGA
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LGA
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Size (mm)
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53 x 56 x 2.95
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40 x 45 x 3.95
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42 x 47 x 2.7
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MIMO Support
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DL 4x4 / UL 2x2
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DL 4x4 / UL 2x2
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-
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GNSS
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GPS / Beidou / Glonass / Galileo
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Same
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Same
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-
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-
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-
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|
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Package Type
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B2B (M2500)
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B2B (M3100)
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LGA 204-pin or M.2
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Size (mm)
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60 × 40 × 3
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46.5 × 60
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29 × 32 × 2.4
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USB
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USB 3.1
|
USB 3.1
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USB 2.0/3.0/3.1
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|
PCle
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PCIe 3.0 (x3)
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PCIe Gen4 x1 + Gen3 x3
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PCIe Gen3
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Ethernet / USXGMII
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USXGMII x2
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USXGMII x2
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-
|
|
SIM
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Dual SIM
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Dual SIM
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SIM
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Protocol Stack
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RNDIS / NDIS / IPv4 / IPv6 / TCP / UDP
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Same
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RNDIS / NDIS / IPv4 / IPv6 / TCP / UDP
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|
Operating Temp (Std)
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-30°C to +75°C
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-30°C to +70°C
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-30°C to +75°C
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Extended Temp
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-40°C to +85°C
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-40°C to +85°C
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-40°C to +90°C
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|
Power Input
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3.3V – 4.3V
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3.3V – 4.35V
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3.3V – 4.35V
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Connecting Innovation. Sigbeat is at the forefront of wireless technology, offering state-of-the-art 4G/5G modules and AI-powered solutions that drive innovation and connect the world.
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