Sigbeat 5G modules are high-performance 5G modules designed to deliver ultra-fast data speeds and low latency for next-generation applications. With its powerful connectivity capabilities, Sigbeat 5G enables seamless communication and real-time processing, making it perfect for smart cities, autonomous vehicles, and advanced IoT solutions.
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Specification
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GB520
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GB530
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GL700
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GL560
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5G Category
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5G Sub-6 + LTE Cat 19
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5G Sub-6 + LTE Cat 20
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3GPP Release
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Release 16
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Release 17
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Processor
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Qualcomm SDX62
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Qualcomm SDX72
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Qualcomm SDX35
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Qualcomm SDX85
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Max 5G Downlink
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3.4 - 3.5 Gbps
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4.14 Gbps
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220 Mbps
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12.5 Gbps
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Max 5G Uplink
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550 - 900 Mbps
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900 Mbps
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3.7 Gbps
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3.7 Gbps
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Max LTE Downlink
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Cat 19
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Cat 20
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200 Mbps
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2 Gbps
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Max LTE Uplink
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-
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-
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75 Mbps
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200 Mbps
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MIMO Support
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DL 4x4 / UL 2x2
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DL 4x4 / UL 2x2
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-
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Advanced (multi-antenna)
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GNSS
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GPS / Beidou / Glonass / Galileo
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Same
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Same
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Same
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-
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-
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-
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On-chip AI, Discrete AI Co-processor (10-40 TOPs)
Uplink Carrier Aggregation, Uplink TX switching |
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Package Type
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B2B (M2500)
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B2B (M3100)
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LGA 204-pin or M.2
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LGA 592-pin or M.2
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Size (mm)
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60 × 40 × 3
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46.5 × 60
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29 × 32 × 2.4
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53 × 56 × 2.95
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USB
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USB 3.1
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USB 3.1
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USB 2.0/3.0/3.1
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USB 3.1
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PCle
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PCIe 3.0 (x3)
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PCIe Gen4 x1 + Gen3 x3
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PCIe Gen3
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PCIe Gen4 x1 + Gen3 x3
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Ethernet / USXGMII
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USXGMII x2
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USXGMII x2
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-
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USXGMII x2
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SIM
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Dual SIM
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Dual SIM
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SIM
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Dual SIM
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Protocol Stack
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RNDIS / NDIS / IPv4 / IPv6 / TCP / UDP
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Same
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RNDIS / NDIS / IPv4 / IPv6 / TCP / UDP
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RNDIS / NDIS / IPv4 / IPv6 / TCP / UDP
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Operating Temp (Std)
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-30°C to +75°C
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-30°C to +70°C
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-30°C to +75°C
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-10°C to +55°C
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Extended Temp
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-40°C to +85°C
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-40°C to +85°C
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-40°C to +90°C
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-
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Power Input
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3.3V – 4.3V
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3.3V – 4.35V
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3.3V – 4.35V
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3.3V – 4.35V
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Target Tier
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High-performance 5G
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Premium 5G (Rel.17)
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Mid-tier / RedCap IoT
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Ultra-high-performance + AI
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Connecting Innovation. Sigbeat is at the forefront of wireless technology, offering state-of-the-art 4G/5G modules and AI-powered solutions that drive innovation and connect the world.
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