Sigbeat development kit has received a major upgrade. Powered by Qualcomm® QCS6490 Chipset, development kit is the latest in the line. Compared to RB3, the performance of the kit has been greatly improved.
The Sigbeat development kit, powered by the QCS6490 processor, is designed for high-performance computing and advanced features, focusing on accessibility. For developers seeking flexibility, the Sigbeat development kit, built on the QCS5430 processor, offers scalable CPU, GPU, AI, and camera capabilities via feature-rich Core and Vision Kits. Both kits target industrial and commercial IoT applications, supporting pin-to-pin compatible SOMs, unified peripheral interfaces, and a shared software stack, simplifying integration and customization.
The Sigbeat development kit is engineered to meet the needs of a diverse range of IoT applications across industries. Its powerful computing capabilities and adaptable AI performance make it ideal for use in advanced robotics, intelligent video analytics, and connected industrial devices. The kit’s compatibility with Core and Visio, feature packs enables custom configurations for applications requiring precise visual processing or enhanced machine learning capabilities. Whether deployed in smart cities, logistics, retail, or manufacturing environments, it offers robust solutions for edge computing, enabling responsive, real-time insights and decision-making directly on-device.
Sigbeat development kit is designed for diverse use cases, including ruggedized handhelds and tablets built to perform in challenging conditions, which is ideal for industries like field services and construction. It also supports advanced dash cameras, enhancing customer experience through features such as driver assistance and real-time monitoring. The kit powers human-machine interface (HMI) systems for industrial settings, delivering critical information and interactive controls to streamline operations. Additionally, its versatility extends to robotics, asset tracking, and smart infrastructure applications, making it a comprehensive solution for modern IoT demands across sectors.
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Item
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Core Kit
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Vision Kit
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Chipset
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QCS6490
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CPU
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Octa-core CPU
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Memory (RAM)
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uMCP package (6 GB LPDDR4x)
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Camera
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2x C-PHY/D-PHY 30-pin expansion ports on interposer board
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1x IMX577 D-PHY 12 MP, 1x OV9282 D-PHY 1 MP with bracket, plus additional D-PHY and GMSL-capable expansion ports
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GPU
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Adreno 643 GPU
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Video
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Adreno 633 VPU: 4K60 fps decode / 4K30 fps encode
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Display
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Up to two displays supported concurrently: Full-size HDMI connector, USB Type-C supporting DP alt mode, mini-DP connector, DSI expansion
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AI
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12 TOPS
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WLAN/Bluetooth
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802.11ax with DBS, Bluetooth 5.2, two onboard printed antennas, RF expansion connectors for optional external antennas
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Storage (onboard)
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uMCP package (128 GB UFS Flash)
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Storage (external)
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1x MicroSD Card Slot, PCIe expansion for NVMe
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PCle
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1x PCIe Gen 3 2-lane to expansion connector, optional 1x PCIe Gen 3 1-lane to expansion connector
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USB
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1x USB 3.0 Type-C, 1xUSB 2.0 w/OTG, 2x USB 3.0 Type-A, 1x USB 3.0 on high-speed expansion
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Audio
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1x DMIC, 2x digital audio amplifiers, I2S/Soundwire/DMIC expansion on low-speed connectors.
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4x DMIC, 2x digital audio amplifiers, I2S/Soundwire/DMIC expansion on low-speed connectors.
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Sensor
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IMU onboard (ICM-42688), additional expansion.
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IMU (ICM-42688), Pressure sensor (ICP-10111),
Mag sensor/compass(AK09915), additional expansion
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